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High Functionality and Small Footprint

The RX671 lineup includes a 4.5 x 4.5 mm 64-pin TFBGA standard package. This is one of the industry's smallest MCUs with 2 MB Flash memory and is pin-to-pin compatible with the RX651. The footprint is 86% smaller than the 64-pin LFQFP package. Competitors have CSP packages in their lineups, but the size of CSP packages depends on the internal silicon die size, so CSP MCUs are not compatible with each other. In addition, competitors' small-size MCUs typically have low operating frequency and memory capacity, but the RX671 has high performance and large capacity memories even in this extremely small package. The RX671 minimizes product size without sacrificing functionality.

PTM Published on: 2022-08-08