GD TSD Tech. Co, Ltd

About

We conduct in-depth research and development of graphics algorithm technology, driving continuous innovation and optimization of our product solutions. This enables us to deliver outstanding image quality and smooth dynamic performance across diverse product applications.

Multi-modal HMI is one of our core differentiators. We can integrate a wide range of interaction modalities including graphics, touch, voice and IoT into our solutions based on customer requirements. By combining visual, tactile and auditory elements, our products deliver a more vivid, engaging interactive interface and a fully immersive, holistic user experience.

As our solutions are continuously deployed across a wide range of end products, comprehensive reliability is our top priority. All our customized and standard products are backed by a professional engineering team, who can rapidly adapt and tailor any solution to fit specific application scenarios.

With the purchase of our products, we grant a royalty-free license for our SDK, enabling customers to develop their own custom applications. Should your engineering team require any assistance during this process, we provide full ongoing technical support. Alternatively, our in-house team of experienced engineers can develop fully customized software tailored to your unique requirements.

Our manufacturing capabilities cover the full value chain, from displays and touch panels to smart modules integrated with operating systems (RTOS and Linux).

Additional Office Location: Rm 606-607, Building 3A, Hechengshiji, Bantian, Longgang, 518129, Shenzhen, Guangdong - China

  • Audio
  • FPGA
  • General Digital/Analog
  • High Density/BGA
  • Robotics
  • USB
  • Video
  • Certifications Example: FCC/RED
  • Design for Manufacturing
  • Die Bonding
  • High-Volume Production
  • Low to Medium Volume Production
  • Prototype Assembly
  • Prototype Testing
  • Rapid Prototyping
  • Test Fixture Development
  • Turnkey Volume Production
  • Enclosure Design
  • Full Product 3D Modeling
  • PCB and Component 3D Modeling
  • Android
  • C/C++
  • GUI
  • Linux
  • RTOS
  • Analog Simulation
  • Block Level System Design and Integration
  • Communication Systems
  • Design for EMI/RFI Immunity
  • Design for Testability
  • PCB Design/Layout
  • Schematic Capture
  • UX/UI
  • Antennas
  • Bluetooth
  • RF Design
  • WiFi
  • ZigBee
  • Aerospace
  • Agriculture
  • Automotive
  • Energy
  • Food and Beverage
  • Government
  • Industrial
  • IoT
  • Marine
  • Medical
  • Oil & Gas
  • STMicro
  • ITE
  • NXP
  • STMicro

Contact

2F/3F/10F, Buinlding 1, Lihao International Industrial Park, Zhutang, Fenggang, 523681, Dongguan City, Guangdong - China
Roger Lo
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