Microchip has developed a new package technology based on copper pillar technology, which enables the cavity of the package to be maximized, allows for the performance and die sizes needed for the application, and minimizes the overall footprint. As can be seen, a dual 150 mA LDO can be fit in a 1mm x 1mm footprint. They have very good PSRR performance of > 60dB of noise rejection while only requiring a very low quiescent current of 32 µA typical per LDO and about 57 µA when both channels are enabled. These are also micro-cap stable, which enables a customer to maintain stability with very small ceramic output capacitors. They offer very low drop-out performance for those applications that are required to work directly off of a battery and provide a 3 volt rail or 2.8 volt rail with little input voltage headroom. These devices are also capable of going down to 1 volt, which not many LDOs can do, especially with a single supply. This part can actually be set down to 1 volt. This is only a fixed version device. Microchip does not currently have an adjustable option. The difference between the MIC5380 and the MIC5381 is that the MIC5381 offers output discharge. This enables customers to shut down the output in a predictable time frame to ensure that it is ready to go when it needs to be re-biased again and brought up to deliver the voltage or current to the load. Its input range is 2.5 to 5.5 volts and features thermal and current limit protection. It also has 2 input enables, so customers can control each output independently. Additionally, this component has a very good accuracy of +/- 2% initial accuracy, with 1% typical with a guarantee to operate to a temperature of 85°C with +/- 2% accuracy. On the right side of this slide is a rendering of the unique 1mm x 1mm footprint, 8-lead package that can be used for any applications concerned with size and available space.