Advanced Thermal Solutions Inc

maxiFLOW™ with maxiGRIP™ Heatsinks

Ultra-high performance BGA cooling solutions with maxiGRIP attachment from Advanced Thermal Solutions

Image of Advanced Thermal Solutions' maxiFLOW™ with maxiGRIP™ HeatsinksAdvanced Thermal Solutions maxiFLOW design features a low-profile, spread-fin array that maximizes surface area for more effective convection (air) cooling. The maxiGRIP attachment applies steady, even pressure to the component and does not require holes in the PCB. These devices meet Telcordia GR-63-Core Office Vibration, ETSI 300 019 Transportation Vibration, and MIL-STD-810 Shock and Unpackaged Drop Testing standards. They come preassembled with high performance, phase changing, thermal interface materials.

maxiFLOW™ with maxiGRIP™ Heatsinks

AbbildungHersteller-TeilenummerBeschreibungVerfügbare MengePreis
HEAT SINK 27MM X 27MM X 7.5MMATS-50270B-C1-R0HEAT SINK 27MM X 27MM X 7.5MM126 - Sofort$13.69Details anzeigen
HEAT SINK 31MM X 31MM X 7.5MMATS-50310B-C1-R0HEAT SINK 31MM X 31MM X 7.5MM300 - Sofort$14.06Details anzeigen
HEAT SINK 17MM X 17MM X 19.5MMATS-51170R-C1-R0HEAT SINK 17MM X 17MM X 19.5MM2559 - Sofort$15.61Details anzeigen
HEAT SINK 35MM X 35MM X 17.5MMATS-50350P-C1-R0HEAT SINK 35MM X 35MM X 17.5MM357 - Sofort$16.71Details anzeigen
HEAT SINK T766ATS-50450G-C3-R0HEAT SINK T766650 - Sofort$9.68Details anzeigen
HEAT SINK 27MM X 27MM X 9.5MMATS-51270D-C1-R0HEAT SINK 27MM X 27MM X 9.5MM237 - Sofort$14.38Details anzeigen
HEAT SINK 31MM X 31MM X 9.5MMATS-51310D-C1-R0HEAT SINK 31MM X 31MM X 9.5MM107 - Sofort$14.85Details anzeigen
HEAT SINK 21MM X 21MM X 14.5MMATS-51210K-C1-R0HEAT SINK 21MM X 21MM X 14.5MM978 - Sofort$14.87Details anzeigen
HEAT SINK 35MM X 35MM X 9.5MMATS-51350D-C1-R0HEAT SINK 35MM X 35MM X 9.5MM183 - Sofort$15.09Details anzeigen
HEAT SINK 31MM X 31MM X 12.5MMATS-50310G-C1-R0HEAT SINK 31MM X 31MM X 12.5MM109 - Sofort$15.18Details anzeigen
HEAT SINK 23MM X 23MM X 17.5MMATS-50230P-C1-R0HEAT SINK 23MM X 23MM X 17.5MM600 - Sofort$15.67Details anzeigen
HEAT SINK 29MM X 29MM X 14.5MMATS-51290K-C1-R0HEAT SINK 29MM X 29MM X 14.5MM347 - Sofort$15.74Details anzeigen
HEAT SINK 19MM X 19MM X 19.5MMATS-51190R-C1-R0HEAT SINK 19MM X 19MM X 19.5MM2504 - Sofort$15.86Details anzeigen
HEAT SINK 27MM X 27MM X 19.5MMATS-51270R-C1-R0HEAT SINK 27MM X 27MM X 19.5MM198 - Sofort$16.81Details anzeigen
HEAT SINK 35MM X 35MM X 19.5MMATS-51350R-C1-R0HEAT SINK 35MM X 35MM X 19.5MM824 - Sofort$17.57Details anzeigen
HEAT SINK 29X29 X 7.5MM W/O TIMATS-50290B-C0-R0HEAT SINK 29X29 X 7.5MM W/O TIM597 - Sofort$7.68Details anzeigen
MAXIGRIP HS ASSY T766 BLU-ANODIZATS-50425G-C3-R0MAXIGRIP HS ASSY T766 BLU-ANODIZ900 - Sofort$9.60Details anzeigen
HEAT SINK 45X45X17.5MM T766ATS-50450P-C3-R0HEAT SINK 45X45X17.5MM T766340 - Sofort$10.47Details anzeigen
HEAT SINK 31MM X 31MM X 12.5MMATS-50350P-C3-R0HEAT SINK 31MM X 31MM X 12.5MM225 - Sofort$11.25Details anzeigen
HEAT SINK 19MM X 19MM X 7.5MMATS-50190B-C1-R0HEAT SINK 19MM X 19MM X 7.5MM114 - Sofort$13.20Details anzeigen
Veröffentlicht: 2012-12-07

Related Videos

ATS Explains - Thermal Interface Material
ATS Explains - Thermal Interface Material

Datum der Veröffentlichung: 2018-01-26

Advanced Thermal Solutions - maxiGRIP
Advanced Thermal Solutions - maxiGRIP

Datum der Veröffentlichung: 2012-10-15

Related Product Highlight

Kühlkörper-Befestigungslösungen Mit den Kühlkörperbefestigungen von Advanced Thermal Solutions können Ingenieure nahezu jeden Kühlkörper auf Leiterplatten mechanisch befestigen.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ and Board Rework Costs maxiGrip delivers enhanced cooling and enables the user to avoid any damage to the PCB and the BGA package itself.
Phase Change - Pressure Increase maxiGRIP™ ATS maxiGRIP and superGRIP are ideal solutions when used with phase change TIM for increased thermal and mechanical performance.