Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
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Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
374324B00035G
374324B00035G

374324B00035G

DigiKey Part Number
HS318-ND
Manufacturer
Manufacturer Product Number
374324B00035G
Description
HEATSINK BGA W/ADHESIVE TAPE
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
Datasheet
 Datasheet
Product Attributes
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Category
Length
1.063" (27.00mm)
Mfr
Width
1.063" (27.00mm)
Series
Fin Height
0.394" (10.00mm)
Packaging
Box
Power Dissipation @ Temperature Rise
3.0W @ 90°C
Part Status
Active
Thermal Resistance @ Forced Air Flow
9.30°C/W @ 200 LFM
Type
Board Level
Thermal Resistance @ Natural
30.60°C/W
Package Cooled
Material
Attachment Method
Thermal Tape, Adhesive (Included)
Material Finish
Black Anodized
Shape
Square, Pin Fins
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 2 482
Check for Additional Incoming Stock
Non-Cancelable/Non-Returnable
All prices are in EUR
Box
QuantityUnit PriceExt Price
1€ 2,25000€ 2,25
10€ 1,99100€ 19,91
25€ 1,89680€ 47,42
50€ 1,82840€ 91,42
100€ 1,76230€ 176,23
250€ 1,67848€ 419,62
756€ 1,58254€ 1 196,40
1 512€ 1,52518€ 2 306,07
5 292€ 1,42656€ 7 549,36
Manufacturers Standard Package
Unit Price without VAT:€ 2,25000
Unit Price with VAT:€ 2,74500