



374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Box | Power Dissipation @ Temperature Rise 3.0W @ 90°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 9.30°C/W @ 200 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Thermal Tape, Adhesive (Included) | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | € 2,25000 | € 2,25 |
| 10 | € 1,99100 | € 19,91 |
| 25 | € 1,89680 | € 47,42 |
| 50 | € 1,82840 | € 91,42 |
| 100 | € 1,76230 | € 176,23 |
| 250 | € 1,67848 | € 419,62 |
| 756 | € 1,58254 | € 1 196,40 |
| 1 512 | € 1,52518 | € 2 306,07 |
| 5 292 | € 1,42656 | € 7 549,36 |
| Unit Price without VAT: | € 2,25000 |
|---|---|
| Unit Price with VAT: | € 2,74500 |











